News：2024
- Release THine Announces the EdgeAI-Link One-Stop Camera/Display Solution, Using its High-Speed SerDes And Qualcomm’s SoC with NPU
- IR THine Announces its New Mid-Term Strategy “Innovate100” from 2025 to 2027
- Release THine announces a new MIPI DSI serializer product for automotive and industrial multi-display use cases and its mass production
- Release THine announces the industry-first optical DSP-less 64Gbps PAM4 chipset for PCIe6.0, saving power by 60%, lowering latency by 90%
- Events THine will be exhibiting at the ECOC Exhibition 2024 in Frankfurt (Germany)
- Products Release New Product Information [V-by-One® HS] THCV353-Q
- Release THine Electronics Joins STMicroelectronics Partner Program to Bring Customer Value of High-Speed Contactless Connectivity and Cultivate Customers’ New Use Cases for Efficiency
- Release THine Introduces THEIA-CAM™ 13MP PDAF Camera Kit for NVIDIA® Jetson Orin™ NX/Nano
- Release THine, NICT and Hiroshima University announced the development of 20Gb/s QPSK Wireless Transmission Technology with the World's First Mixed-Signal Baseband Demodulator Technology
- Release THine Announces the first standalone camera ISP Linux Driver in the Linux Mainline Kernel
- Release THine releases to launch AI server business in addition to LSI and AIOT business
- Products Release New Product Information [Video Extension] THSER102
- Release Kappa optronics Uses THine’s V-by-One® HS Chipset for their Rearview OneBox® Automotive Camera Monitoring Solutions
- Release Sensorview and THine announce to develop a demonstration of a high-speed contactless connectivity solution, incorporating STMicroelectronics’ contactless transceivers, exhibiting at MWC
- Release THine Introduces a New Camera Cable Extension Kit for Raspberry Pi Camera Modules Supporting the Latest V3 Camera and Pi 5 Computer