THine will be exhibiting at the ECOC Exhibition 2024 in Frankfurt (Germany)
THine Electronics will be exhibiting at the upcoming ECOC Exhibition 2024 (50th European Conference on Optical Communications) in Frankfurt, Germany, from 23 (Mon) to 25 (Wed) September 2024. Exhibitors.
The annual European Conference on Optical Communications (ECOC), held in Europe, is one of the most important international conferences in the field of optical communication, along with the Optical Fibre Communication Conference & Exposition (OFC), also held annually in the USA.
Overview of the event
Dates : 23 Sept (Mon) - 25 Sept (Wed), 2024
Time : 9:30-17:00 (last day until 16:30)
Venue : Congress Center Messe Frankfurt
Ludwig-Erhard-Anlage 1, 60327 Frankfurt am Main, Germany
Hall : Level 5.1
Booth no. : E1
Admission : Free of charge
Click here for a site map of Congress Center Messe Frankfurt Source: EKH-Pictures - stock.adobe.com
Time : 9:30-17:00 (last day until 16:30)
Venue : Congress Center Messe Frankfurt
Ludwig-Erhard-Anlage 1, 60327 Frankfurt am Main, Germany
Hall : Level 5.1
Booth no. : E1
Admission : Free of charge
Click here for a site map of Congress Center Messe Frankfurt Source: EKH-Pictures - stock.adobe.com
Exhibit details
The exhibition will showcase our new PCIe 6.0-compliant multi-mode AOC solution and chipsets for realising large scale AI systems. This also is the solution exhibited in the 2nd COMNEXT, Next Generation Communication Technology & Solutions Expo (venue: Tokyo) held recently from 26 (Wed) to 28 (Fri) June 2024, where it received a very positive response.
This next generation chipset consists of a CDR, a highly linear VCSEL Driver and a TIA. With the start of 400G PAM4 use in data centres, the power consumed by cloud service providers continues to increase dramatically, with one of the main drivers being the PAM4 DSPs used to maintain signal quality in the optical communication modules.
The chipset enables an AOC solution that can restore signals even with the DSP completely removed not only from within the optical communication module, but also from the end-point ASIC.
The value that this PCIe 6.0-complied DSP-less AOC provides to users includes: reducing power consumption in optical communications by more than 50%; realising low latency, which is important for machine learning and AI applications; and reducing system costs by removing the DSP, which is a high BOM cost factor.
A press release on the products to be exhibited was issued on 10th of September, 2024.
Please click here for the release.
We are highly looking forward to seeing you at ECOC2024!
The exhibition at COMNEXT (held in June 2024)
This next generation chipset consists of a CDR, a highly linear VCSEL Driver and a TIA. With the start of 400G PAM4 use in data centres, the power consumed by cloud service providers continues to increase dramatically, with one of the main drivers being the PAM4 DSPs used to maintain signal quality in the optical communication modules.
The chipset enables an AOC solution that can restore signals even with the DSP completely removed not only from within the optical communication module, but also from the end-point ASIC.
The value that this PCIe 6.0-complied DSP-less AOC provides to users includes: reducing power consumption in optical communications by more than 50%; realising low latency, which is important for machine learning and AI applications; and reducing system costs by removing the DSP, which is a high BOM cost factor.
A press release on the products to be exhibited was issued on 10th of September, 2024.
Please click here for the release.
We are highly looking forward to seeing you at ECOC2024!