Manufacturing Bases, Packaging, and Delivery Formats

Manufacturing Bases

Our primary manufacturing sites are the following fab partners.

Examples of Supported Packaging

These are examples of packaging we have experience with.

  • SOP/TSOP
  • LQFP/TQFP
  • QFN
  • BGA
  • LGA
  • TFBGA/VFBGA(FlipChip)
  • Wafer Level CSP

We can also accommodate packaging not listed here. If your desired packaging is not listed, please inquire via the button below.

Example Delivery Formats

Examples of our main proven delivery formats.

  • Tray
  • Tape & Reel
  • Tube
  • Waffle Pack

We can also accommodate packaging methods not listed here. Please inquire using the button below.

Custom IC Consultation Form

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