THine Introduces MIPI CSI-2 4Gbps/lane SerDes Chipset
-Provides Designers the ability to extend and aggregate images from Dual HD
cameras for greater than 15 meters-
Enables new high-performance video capabilities for 3D visualization & recognition,
autonomous cars, robotics, medical equipment, gaming, XR devices, etc.
TOKYO, JAPAN (August 1, 2019), SANTA CLARA, CA (July 31, 2019) – THine®, the leader in high-speed serial interfaces and image signal processing, today announced the high-volume availability of their new MIPI CSI-2 extension chipset, THCV241A and THCV242.
This new chipset allows engineers to extend MIPI CSI-2 transmission from 1 foot to over 15 meters!
These exciting new video chips also enable designs that can receive 2 different video inputs simultaneously, as well as applications that can copy and distribute (simultaneously replicate) 1 video stream into 2.
Demands for higher resolution and/or higher frame rate cameras require MIPI CSI-2 output, which are limited to a short transmission range of approximately 1 foot. THCV241A serializes up to 4 lanes of MIPI CSI-2 signals and converts it into 1 or 2 lanes of V-by-One® HS, (developed and owned by THine).
V-by-One® HS technology supports up to 4 Gbps per lane which is robust enough to extend the transmission of 1080p60 2Mpixel uncompressed video for greater than 15 meters with typical cables. THCV241A’s 2 lanes of V-by-One® HS supports up to an 8 Gbps data rate with the capability to use the second V-by-One® HS lane to support data copy and distribution (replication) applications.
The THCV242 chip deserializes up to 2 V-by-One® HS lanes back to the original MIPI CSI-2 signal.
The chipset supports “Sub-Link” that aggregates bidirectional low speed signals, such as GPIO. The separation of high speed signal path, V-by-One® HS, and Sub-Link enables easy debugging and gives more choices for physical harnesses including the utilization of Keyssa®’s contactless connection for systems benefiting from or requiring a ruggedized, low latency, detachable camera (https://www.thine.co.jp/en/news_details/id=1314).
Mirrored video signal redundancy that is supported by this chipset can be used for troubleshooting system problems or for applications such as agricultural robotics and 3D surgical equipment which require a secondary application processor that is distant from the source video camera. Also, any applications that require cameras far from host processors can utilize the features of this chipset.
“This chipset will give more freedom to designers for leading edge technologies, such as Autonomous and 3D visualizing,” said Tak Iizuka, Chief Solution Architect of THine. “The capability to support 2 V-by-One® HS inputs enable new and exciting dual camera applications, like 3D recognition and XR devices that usually require multiple cameras.”
Yasuhiro Takada, CEO of THine, said “We are excited to announce this new chipset because this enables our customers to bring products to market faster, and also gives them the ability to develop new types of applications with a variety of form factors that were not previously possible.”
The chipset is now available through major distributors, including Digi-Key (https://www.digikey.com/en/product-highlight/c/cel/thine-v-by-one-hs-transmitter-receiver-family).
■An Application Example
* “V-by-One” is a registered trademark of THine Electronics, Inc.
* “MIPI” is a registered trademark of MIPI Alliance, Inc.
THine provides innovative mixed signal, analog, and wireless system technologies. The technologies provided include V-by-One® HS, LVDS, other high-speed data signaling, ISP, timing controller, analog-to-digital converter, power management, drivers for LEDs and motors, and IoT/M2M devices, 4G/LTE/5G mobile communication devices. THine is headquartered in Tokyo, and has subsidiaries in Santa Clara, Taipei, Seoul, Hong Kong, Shenzhen, and Shanghai. THine is listed on JASDAQ of Tokyo Stock Exchange under the security code of 6769. For more information, visit http://www.thine.co.jp/en/.
CEL offers a broad selection of wireless and networking components including RF/microwave
transistors and ICs, opto-couplers, laser diodes, photo diodes and high-speed interface ICs. CEL also designs and produces MeshConnect® modules and other wireless solutions for IoT applications. CEL has technical centers in Santa Clara, California (Silicon Valley) and Buffalo Grove, Illinois (Chicago area). CEL supports customers through direct sales offices, sales representatives and distributors worldwide, with offices in Hong Kong and Tokyo that support the Asia Pacific region. For more information, visit http://www.cel.com/.
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