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THine Announces its Optical DSP-Free Multi-Channel Technology, “ZERO EYE SKEW” for 2.0TB/s Linear Pluggable Optical Solutions of Short Reach Scale Up
2025.07.09 Release
TOKYO (July 9th, 2025) – THine Electronics, Inc. (Tokyo Stock Exchange: 6769, “THine”), a global leading fabless semiconductor supplier of innovative mixed signal LSI and analog technologies as well as valuable AI/IoT-based solutions and AI/data servers, today announced its optical DSP-free technology, “ZERO EYE SKEWTM” for 1TB/s and 2TB/s linear pluggable optical (LPO) solutions, enabling to save power by 60% in 1.0TB/s or 73% in 2.0TB/s and to lower latency by 90%.
Japanese Government’s Beyond 5G (6G) Fund operated by NICT* has also adopted THine’s three-year project of developing VCSEL driver and TIA with its “ZERO EYE SKEWTM” technology as its project with supporting several million dollars (at least 622 million Japanese Yen for the first two fiscal years of 2025 and 2026).
THine’s VCSEL drivers and TIAs can achieve ultra-low latency, ultra-low power consumption, multi-channel high density, and low costs, accelerating product development for ultra-high-speed 2.0TB/s (128Gbps/lane) or 1.0TB/s (64Gbps/lane) optical transceivers. These transceivers will be used in the next-generation communication standard PCI Express 7.0/6.0 (hereinafter “PCIe7/6”).
Conventional high-speed optical transmission lines typically employ DSPs for digital processing to maintain signal quality, but this digital processing incurs significant power consumption and latency. While DSP is utilized for long-distance transmission over distances of 1km to 100km, in Scale Up applications where numerous GPU/CPU and memory components of AI servers are interconnected to function as a single massive AI server - both latency and power consumption become critical challenges.
To address these challenges, THine develops VCSEL drivers and TIAs within three years. These devices will utilize THine’s proprietary “ZERO EYE SKEWTM” technology to maintain signal quality through fully analog transmission while achieving ultra-low latency (90% reduction compared to conventional methods at 2.0TB/s), ultra-low power consumption (73% reduction), multi-channel high density, and low cost.
Overview of THine's DSP-Free Multi-Channel VCSEL Drivers and TIAs
Through collaboration with partners, THine plans to provide the global market with linear pluggable optical solutions that simultaneously meet the demands for ultra-low power consumption, ultra-low latency, high density, and low cost simultaneously.
* NICT: the National Institute of Information and Communications Technology of Japan
NICT operates “Innovative Information and Communications Technology (Beyond 5G (6G)) Fund.” In the fiscal year 2025, this Beyond 5G (6G) Fund has set its “Research and Development Project on Multi-Channel Optical Wiring Integration Technology for Data Centers” and has adopted THine’s project.
NICT has announcement through: https://www.nict.go.jp/press/2025/07/09-1.html (Japanese only)
About THine
THine Electronics Incorporated is a fabless semiconductor manufacturer that provides innovative mixed signal LSI and analog technologies. In addition to optical chipsets, THine’s technologies include V-by-One® HS plus, LVDS, other high-speed data signaling, ISP, timing controller, analog-to-digital converter, power management, and drivers for LEDs/motors as well as providing AI/IoT/M2M solution through THine MobileTek, Inc. and AI/data server solution through THine Hyperdata, Inc.
THine is headquartered in Tokyo, and has subsidiaries in Yokohama, Taipei, Seoul, Hong Kong, Shenzhen, Shanghai, and Santa Clara. THine is listed on Tokyo Stock Exchange under the security code of 6769. For more information, please visit https://www.thine.co.jp/en/.
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