Press Release
2008.11.05
THine and Winbond agree to transfer Winbond's ISP Business to THine
TOKYO (November 5, 2008) -- THine Electronics, Inc. (JASDAQ: 6769, “THine”) and Winbond Electronics Corp. (Taiwan Stock Exchange: 2344, “Winbond”) announced that the two companies agreed to transferWinbond’s Image Signal Processor (ISP) Business to THine.
Winbond’s ISP products are specially designed to meet the increasing needs of high-end camera and
mobile phones. Incorporated with a high-quality ISP engine, it works with advanced CMOS sensors of
mainly 3 mega pixels to 5 mega pixels and auto focus actuators to deliver 3G-capable performance for smart
phones or high-end feature phones. Its revenue of ISP business in fiscal year 2007 was NT$323 million.
Winbond will transfer ISP Business and accelerate to reinforce its operating efficiency, following to the
strategic carve-out of Nuvoton Technology Corp. on July 1st, 2008.
THine will acquire the ISP team with technological advantages and achieve synergy effects with THine’s competitive edge of advanced interface technologies such as V-by-One®HS in the growing markets of security cameras, automotive camera systems, amusement machines as well as cell phone handsets and mobile gadgets with camera system in order to deliver new value added for image processing solution.
THine will acquire the ISP team with technological advantages and achieve synergy effects with THine’s competitive edge of advanced interface technologies such as V-by-One®HS in the growing markets of security cameras, automotive camera systems, amusement machines as well as cell phone handsets and mobile gadgets with camera system in order to deliver new value added for image processing solution.
Winbond will transfer assets including Winbond’s intellectual property rights and ISP related assets in
fiscal year 2008, establishing a new company to transfer to THine.
About THine Electronics, Inc.
THine Electronics Incorporated is a fabless maker that provides innovative mixed signal LSI and analog
technologies such as LVDS, advanced high-speed interface such as V-by-One®HS, timing controllers,
high-speed 10 bit analog-to-digital converters, RF-IC and power management IC in growing niche markets
for our customers’ solutions, targeting its strategic markets in high definition televisions, LCD monitors,
mobile handsets, and automotive markets. THine also operates an electronics-focused venture capital fund,
E-nova. THine is headquartered in Tokyo, Japan, and has design centers in Kyoto and Kyushu, Japan, as
well as a marketing subsidiary in Taipei, Taiwan. THine Electronics is listed on the JASDAQ under the
security code of 6769. For additional information, please visit the web site at http://www.thine.co.jp.
About Winbond Electronics Corp.
Winbond Electronics Corp. was founded in 1987 in Hsinchu Science Park, Taiwan and has been publicly
traded on the Taiwan Stock Exchange since 1995. In October 2008, the headquarters is relocated to Central
Taiwan Science Park where newly built the 300mm wafer fab. The site is mainly focusing on research &
development and production, of which the process technology covers from 90nm~65nm.
Winbond focuses on the Memory Products design and manufacturing with three main business
groups—DRAM Product Business Group, Memory IC Manufacturing Business Group, and Flash Memory
IC Business Group. To maintain its long-term relationships with its customers and strengthen regional
supports, Winbond has set up subsidiaries in the USA, Japan, and Hong Kong. For more information, please
visit: http://www.winbond.com
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TRADEMARKS
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PRESS CONTACT
THine Electronics, Inc.
Yasuhiro Takada
Phone: +81-3-3270-0666
Email: ir@thine.co.jp
Winbond Electronics Corp. Japan
Shigeru Narishima
Phone: +81-45-478-1881
E-mail: snarishi@winbond.com
