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Press Release 2005

2005.10.31 THine discloses techniques for advanced interface technologies at the first A-SSCC
2005.07.11 THine releases its new RF-IC for advanced cellular infrastructures
New buffer amplifier IC with industries' best isolation
2005.05.31 THine unveils an advanced Ser/Des chipset by V-by-One(TM) technology
V-by-One(TM) reduces number of cables by 90% and extends transmission of digital pixel data up to 10m
2005.05.23 THine releases new power management products for flat televisions ¡ÝNew lineups of Powerlinker(TM) series support safer power sequences and cost reduction¡Ý
2005.05.16 THine releases new RF buffer amplifier for CDMA2000 1x-EVDO THine's new products can reduce print circuit board sizes and costs for high-speed downlink handsets
2005.02.07 THine releases 30bit LVDS product for full HDTV of 1080p resolution
2005.01.31 THine enters automotive markets with its LVDS interfaces